Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit potentials of ...

Fujifilm announced its plan to strengthen its business in materials for semiconductor back-end processes at a semiconductor materials business briefing held in Tokyo on July 15, 2025. The company aims ...

Rapidus Chiplet Solutions, a new R&D facility and clean room, will be located on Seiko Epson's Chitose campus TOKYO and HOKKAIDO, Japan, Oct. 3, 2024 /PRNewswire/ -- Rapidus Corporation, a company ...

The Busan Metropolitan Office of Education (Superintendent Kim Seokjun) has opened a semiconductor education center where both front-end and back-end semiconductor processes can be practiced, the ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

Supporting Japan's leading-edge semiconductor development and manufacturing with one-stop solutions through a broad product ...

TL;DR: Samsung Electronics has begun developing its next-generation 1nm process node, termed the "dream semiconductor process," requiring new technologies and High-NA EUV lithography. Mass production ...

Intel Corp (NASDAQ:INTC) has tapped its long-term supplier, Taiwan Semiconductor Manufacturing Co (NYSE:TSM), for its advanced 2nm process. Intel and Taiwan Semiconductor are collaborating on a 2nm ...

The semiconductor industry continually pushes the boundaries of device performance through advanced process modelling and epitaxial growth techniques. In this context, sophisticated simulation methods ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

When contamination defects surface in advanced nodes, the root cause often spans tools, materials, and handling. This piece outlines how defect mapping, TEM, and SPC data converge to prove causation.